Huawei Says It Could Reach 1.4nm-Level Chip Design by 2031 Despite U.S. Sanctions
Chinese tech giant Huawei Technologies has announced an ambitious long-term semiconductor goal, saying it expects to design high-end chips with transistor density comparable to 1.4-nanometre technology by 2031, even as U.S. sanctions continue to limit China’s access to advanced chipmaking equipment.
The announcement was made during the 2026 IEEE International Symposium on Circuits and Systems (ISCAS) held in Shanghai. Huawei introduced what it calls the “Tau Scaling Law,” a new approach aimed at improving chip performance without relying entirely on shrinking transistor sizes.
The concept was presented by He Tingbo, president of Huawei’s semiconductor business and director of the company’s Scientist Committee, during a keynote speech titled “New Semiconductor Path in Practice.”
A Different Path for Advanced Chips
For years, the global semiconductor industry has depended on making transistors smaller to improve performance and efficiency. However, as physical limits become harder to overcome, companies are searching for alternative methods to continue advancing computing power.
Huawei says its Tau Scaling Law focuses on reducing the time it takes for signals and data to travel through chips and computing systems. According to the company, this could significantly improve performance and chip density even without access to the world’s most advanced manufacturing tools.
The strategy is especially important for China because U.S. export restrictions have limited Chinese companies’ access to advanced lithography machines and other key semiconductor technologies needed for cutting-edge chip production.
LogicFolding Architecture to Debut in 2026
Huawei also revealed that its upcoming Kirin chips, expected to launch in late 2026, will be the first to use a new architecture called “LogicFolding.”
The company claims the technology shortens internal chip wiring, helping improve speed and efficiency while reducing delays in data movement inside processors.
Although Huawei did not release independent benchmark data to support the claims, the announcement has attracted attention because 1.4nm technology is expected to represent the global frontier of semiconductor development by the end of the decade.
Hundreds of Chips Already Developed
According to Huawei, the company has already designed and mass-produced 381 chips over the past six years using principles related to the Tau Scaling Law.
These chips have reportedly been used across several industries, including smartphones, artificial intelligence computing, and other advanced digital applications.
The announcement highlights China’s broader push to build a more self-reliant semiconductor ecosystem as geopolitical tensions continue reshaping the global tech industry.